ATS045045011-SF-15J

Advanced Thermal Solutions
984-AT045045011SF15J
ATS045045011-SF-15J

Mfr.:

Description:
Heat Sinks BGA Heat Sink, Straight Fin, No TIM, Black Anodized, 45x45x11mm (LxWxH)

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Availability

Stock:
7 Can Dispatch in 20 Days
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
7,77 € 7,77 €
7,44 € 74,40 €
7,03 € 140,60 €
6,61 € 330,50 €
6,20 € 620,00 €
5,78 € 1.156,00 €
5,56 € 2.780,00 €
5,35 € 5.350,00 €

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
PCB
Aluminum
Straight Fin
6.57 C/W
45 mm
45 mm
11 mm
Brand: Advanced Thermal Solutions
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Packaging: Bulk
Product Type: Heat Sinks
Series: BGA High Aspect Ratio
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: Value-Line Platform
Type: Component
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

USHTS:
7616995100
ECCN:
EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera®, AMD, Freescale, Intel®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.