ATS035035017-SF-11P

Advanced Thermal Solutions
984-AT035035017SF11P
ATS035035017-SF-11P

Mfr.:

Description:
Heat Sinks BGA Heat Sink, Straight Fin, No TIM, Black Anodized, 35x35x17mm (LxWxH)

Datasheet:
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.
More Information
Learn more about Advanced Thermal Solutions ATS035035017-SF-11P

Availability

Stock:
25 Can Dispatch in 20 Days
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
7,24 € 7,24 €
5,96 € 59,60 €
5,82 € 116,40 €
5,70 € 570,00 €
5,38 € 1.076,00 €
5,24 € 2.620,00 €
5,04 € 5.040,00 €
4,88 € 9.760,00 €

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
PCB
Aluminum
Straight Fin
4.42 C/W
35 mm
35 mm
17 mm
Brand: Advanced Thermal Solutions
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Packaging: Bulk
Product Type: Heat Sinks
Series: BGA High Aspect Ratio
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: Value-Line Platform
Type: Component
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Datasheet

This functionality requires JavaScript to be enabled.

USHTS:
7616995100
ECCN:
EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera®, AMD, Freescale, Intel®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

An unexpected error has occurred.


Have a question? Please visit the Help Centre.
For questions about a specific order, please log in to your account.

If you encounter further problems, please contact us on 800-346-6873 or email help@mouser.com.