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ATS031031007-PF-10F

Name: Advanced Thermal Solutions ATS031031007-PF-10F
Brand: Advanced Thermal Solutions
SKU: 984-AT031031007PF10F
Price: 5.78 EUR
Availability: InStock

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Mouser No:

984-AT031031007PF10F

Mfr. No:

ATS031031007-PF-10F

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Cross Cut, No TIM, 31x31x7mm

Datasheet:

ATS031031007-PF-10F Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS031031007-PF-10F

In Stock: 75

Stock:: 75 Can Dispatch Immediately

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Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	5,78 €	5,78 €
	5,13 €	51,30 €
	4,88 €	97,60 €
	4,70 €	235,00 €
	4,49 €	449,00 €
	4,27 €	854,00 €
	4,15 €	2.075,00 €
	4,01 €	4.010,00 €
	3,93 €	7.860,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	PCB
Heatsink Material:	Aluminum
Fin Style:	Omnidirectional Fin
Thermal Resistance:	12.23 C/W
Length:	31 mm
Width:	31 mm
Height:	7 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	BGA High Aspect Ratio
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	Value-Line Platform
Type:	Component

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Datasheet

ATS031031007-PF-10F Datasheet (PDF)

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TARIC:: 8542900000
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
MXHTS:: 8542900100
ECCN:: EAR99

Pin Fin Value-Line Heat Sinks

Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.