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ATS014014025-SF-3X

Name: Advanced Thermal Solutions ATS014014025-SF-3X
Brand: Advanced Thermal Solutions
SKU: 984-ATS014014025SF3X
Price: 6.86 EUR
Availability: OutOfStock

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Mouser No:

984-ATS014014025SF3X

Mfr. No:

ATS014014025-SF-3X

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 14x14x25mm

Datasheet:

ATS014014025-SF-3X Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS014014025-SF-3X

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 8 Weeks Estimated factory production time.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	6,86 €	6,86 €
	6,13 €	61,30 €
	5,84 €	116,80 €
	5,63 €	281,50 €
	5,42 €	542,00 €
	5,11 €	1.022,00 €
	4,97 €	2.485,00 €
	4,79 €	4.790,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	PCB
Heatsink Material:	Aluminum
Fin Style:	Straight Fin
Thermal Resistance:	7.53 C/W
Length:	14 mm
Width:	14 mm
Height:	25 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	BGA High Aspect Ratio
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	Value-Line Platform
Type:	Component

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Datasheet

ATS014014025-SF-3X Datasheet (PDF)

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Compliance Codes

USHTS:: 7616995100
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera^®, AMD, Freescale, Intel^®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.