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cExpress-SL-i5-6300U

Name: ADLINK Technology cExpress-SL-i5-6300U
Brand: ADLINK Technology
SKU: 976-CEXP-SL-I5-6300U
Price: 919.52 EUR
Availability: OutOfStock

Mouser No:

976-CEXP-SL-I5-6300U

Mfr. No:

cExpress-SL-i5-6300U

Mfr.:

ADLINK Technology

Description:

Computer-On-Modules - COM cExpress-SL-i5-6300UCompact COM Express Type 6 module with Intel i5-6300U with GT2 level graphics

Datasheet:

cExpress-SL-i5-6300U Datasheet

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	919,52 €	919,52 €
	891,10 €	8.911,00 €
25	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	ADLINK Technology
Product Category:	Computer-On-Modules - COM
RoHS:
Form Factor:	COM Express Compact Type 6
Brand:	ADLINK Technology
Product Type:	Computer-On-Modules - COM
Series:	cExpress-SL
Factory Pack Quantity:	1
Subcategory:	Computing

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Datasheet

cExpress-SL-i5-6300U Datasheet

PCN

EU Declaration of Conformity (PDF)

Express-SL/SLE COM

ADLINK Express-SL/SLE is a COM.0 R2.1 Basic Size Type 6 computer-on-module supporting the 64-bit 6th Generation Intel® Core™, Xeon® E3, and Celeron® processors (formerly "Skylake-H") with Intel® QM170, HM170, CM236 Chipset. The Express-SL/SLE provides outstanding, high-performance graphics processing, reduced development time, and long-lifecycle support. The device features Intel Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual-channel memory at 1866/2133MHz with ECC/non-ECC support determined by CPU/chipset combination. This combination ensures the excellent overall performance of the module. High-speed connectivity of the CPU to the Intel QM170, HM170, CM236 Chipset is supported through an Intel Flexible Display Interface and Direct Media Interface.

COM Express Modules

ADLINK Technology has announced COM Express computer-on-modules (COMs) based on the 6th generation Intel Core i7/i5/i3 processors and latest Xeon processors. These modules follow the form, fit, function design principle for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.