LEC-iMX8MP-Q-2G-32G-ER

ADLINK Technology
976-LECIMX8MP2G32GER
LEC-iMX8MP-Q-2G-32G-ER

Mfr.:

Description:
Computer-On-Modules - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 2 GB LPDDR4, 32 GB eMMC, -40 C to 85 C

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 8

Stock:
8 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
213,27 € 213,27 €
210,97 € 2.109,70 €
206,02 € 5.150,50 €
200,13 € 10.006,50 €
100 Quote

Product Attribute Attribute Value Select Attribute
ADLINK Technology
Product Category: Computer-On-Modules - COM
RoHS:  
NXP
i.MX 8M Plus
512 kB
5 VDC
CAN, GPIO, I2C, I2S, SDIO, SPI, UART
- 40 C
+ 85 C
Brand: ADLINK Technology
Memory Size: 2 GB
Memory Type: LPDDR4
Product Type: Computer-On-Modules - COM
Factory Pack Quantity: 1
Subcategory: Computing
Part # Aliases: 91-72512-202E
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Compliance Codes
TARIC:
8471500000
CAHTS:
8471500090
USHTS:
8471500150
JPHTS:
847150000
MXHTS:
8471500100
ECCN:
4A994.a
Origin Classifications
Country of Origin:
Taiwan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

LEC-IMX8MP SMARC 2.1 Short Size Modules

ADLINK Technology LEC-IMX8MP SMARC 2.1 Short Size Modules are based on the powerful NXP i.MX8M Plus (quad-core Arm Cortex-A53) processor. The devices have an optional neural processing unit (NPU) that operates at up to 2.3 TOPS. It is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. The devices also support dual image signal processors and two camera inputs for an effective vision system. The LEC-IMX8MP is suited for applications such as smart home, building, city, and industry 4.0.