I-COM-HPC-sIDH-2796-X557 Dev Kit

ADLINK Technology
976-ICOMHPCS2796X557
I-COM-HPC-sIDH-2796-X557 Dev Kit

Mfr.:

Description:
Development Boards & Kits - x86 COM-HPC Intel Ice Lake-D HCC development kit with D-2796 CPU module, with carrier, X557 OCP, heatsink and accessories

Lifecycle:
New Product:
New from this manufacturer.

Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
5.862,05 € 5.862,05 €

Product Attribute Attribute Value Select Attribute
ADLINK Technology
Product Category: Development Boards & Kits - x86
Development Kits
Xeon D-2796
COM-HPC-sIDH-D-2796TE
Brand: ADLINK Technology
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: Not Available
Product Type: Development Boards & Kits - x86
Factory Pack Quantity: 1
Subcategory: Development Tools
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

An unexpected error has occurred.


Have a question? Please visit the Help Centre.
For questions about a specific order, please log in to your account.

If you encounter further problems, please contact us on 800-346-6873 or email help@mouser.com.