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IM69D130V01XTSA1

Name: Infineon IM69D130V01XTSA1
Brand: Infineon Technologies
SKU: 726-IM69D130V01XTSA1
Price: 1.93 EUR
Availability: InStock

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Mouser No:

726-IM69D130V01XTSA1

Mfr. No:

IM69D130V01XTSA1

Mfr.:

Infineon Technologies

Description:

MEMS Microphones MIC DBP DIGITAL

Datasheet:

IM69D130V01XTSA1 Datasheet (PDF)

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More Information

Learn more about Infineon Technologies IM69D130V01XTSA1

In Stock: 122

Stock:: 122

Can Dispatch Immediately

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On Order:: 22.000

Expected 2/18/2027

13.000

TBD
Factory Lead Time:: 30

Weeks Estimated factory production time for quantities greater than shown.

Long lead time reported on this product.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

-,-- €

Ext. Price:

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Est. Tariff:

Packaging:

Full Reel (Order in multiples of 1000)

Cut Tape

MouseReel™ (+5,00 €)

Pricing (EUR)

Qty.	Unit Price	Ext. Price
Cut Tape / MouseReel™ ^†
	1,93 €	1,93 €
	1,52 €	15,20 €
	1,39 €	34,75 €
	1,29 €	64,50 €
	1,25 €	125,00 €
	1,17 €	585,00 €
Full Reel (Order in multiples of 1000)
	1,05 €	1.050,00 €

† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	MEMS Microphones
RoHS:
Sensitivity:	- 36 dB
Tolerance:	1 dB
SNR - Signal to Noise Ratio:	69 dBA
Frequency Range:	2.9 MHz to 3.3 MHz
Operating Supply Current:	980 uA
Operating Supply Voltage:	1.62 V to 3.6 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 70 C
Output Type:	Digital
Port Type:	Bottom
Length:	4 mm
Width:	3 mm
Depth:	1.2 mm
Packaging:	Reel
Packaging:	Cut Tape
Packaging:	MouseReel
Brand:	Infineon Technologies
Dimensions:	4 mm x 3 mm x 1.2 mm
Directional Properties:	Omnidirectional
Mounting Style:	SMD/SMT
Package/Case:	LGA-5
Product Type:	MEMS Microphones
Shape:	Rectangular
Sound Pressure Level:	128 dB
Factory Pack Quantity:	1000
Subcategory:	Microphones
Supply Voltage - Max:	3.6 V
Supply Voltage - Min:	1.62 V
Technology:	MEMS
Termination Style:	SMD/SMT
Tradename:	XENSIV
Type:	Digital MEMS Microphone
Part # Aliases:	IM69D130V01 SP001676962
Unit Weight:	33,720 mg

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Compliance Codes

TARIC:: 8542399000
CNHTS:: 8542391010
CAHTS:: 8542390000
USHTS:: 8518108030
MXHTS:: 8542399901
ECCN:: EAR99

Origin Classifications

Country of Origin:: Singapore
Assembly Country of Origin:: China
Country of Diffusion:: Singapore

The country is subject to change at the time of shipment.

XENSIV™ MEMS Microphones

Infineon XENSIV™ MEMS Microphones are designed for applications requiring low self-noise (high SNR), wide dynamic range, distortions below 1% at 128dBSPL, and a high acoustic overload point. The microphones have a 70dB signal-to-noise ratio (SNR). The XENSIV™ MEMS Microphones offer crystal clear audio signals, an extended pick-up distance and sensitivity to both soft and loud signals in applications.

Intuitive Sensing Technology

Infineon Technologies Intuitive Sensing Technology enables simple, effortless user interactions with all kinds of smart devices. Bridging the gap between the real and digital worlds, Intuitive Sensing Technology is developed to make life easier, safer, greener, and more efficient. The essential value of sensor technology lies in making customer lives more convenient through seamless, natural interactions between people and sensing devices, leaving users free to focus on what matters in life.

Sensor Solutions

Infineon Technologies Sensor Solutions make life smarter, safer, and greener with a broad range of sensors for various applications in automotive, industrial, and home markets. Infineon sensors are exceptionally precise, thanks to industry-leading technologies. They are ideal for a wide range of applications in the automotive, industrial, and consumer markets. Sensors are the link and the enabling element in the interaction between people and devices. This interaction often depends on collecting, merging, and interpreting information from different sources. Infineon’s sensor solutions applications can rise to the next level of innovation and provide users with a smoother and more reliable interaction with technology.